改进遗传算法在CMP终点检测的应用

doi:10.3969/j.issn.1000-1158.2020.10.03

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Abstract In order to improve the accuracy and efficiency of chemical mechanical polishing (CMP) endpoint detection, a method based on reflection method for CMP online endpoint determination was proposed. Firstly, the film thickness and refractive index of SiO₂ film were fitted by the improved simplex hybrid genetic algorithm (GA). Secondly, the average reflectance in the range of 200～1200nm was used as the eigenvalue, and a reference table of reflectance average values under different film thickness conditions was obtained. The difference between the real-time reflectance and the preset film thickness reflectance, and the eigenvalue with its changing trend were used as the CMP endpoint detection conditions. The experimental results demonstrate that the average relative error of the hybrid algorithm is less than 0.21%, the average relative error of the refractive index is less than 1.07%, and the eigenvalue calculation speed is fast, which meets the time requirement of online dynamic polishing.

Key words： metrology film thickness CMP endpoint detection genetic algorithm reflectance

Received: 24 July 2019 Published: 10 October 2020

PACS:	TB921
	TB973

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	Articles by authors
	ZHENG Yong-jun
	DI Wei-yu
	LUO Zai

Cite this article:

ZHENG Yong-jun,DI Wei-yu,LUO Zai. Application of Improved Genetic Algorithm in CMP Endpoint Detection[J]. Acta Metrologica Sinica, 2020, 41(10): 1192-1198.

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http://jlxb.china-csm.org:81/Jwk_jlxb/EN/10.3969/j.issn.1000-1158.2020.10.03 OR http://jlxb.china-csm.org:81/Jwk_jlxb/EN/Y2020/V41/I10/1192

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